Solder with a tin-lead composition has always been the most common type of solder used in electronic assembly. However, lead has recently become a cause for concern due to the side effects it can have on human health.
With the rise of environmental awareness, all electronics companies worldwide banned all products containing lead from 1 July 2006, making the electronics industry completely "Lead free".The Research and Development Division of the Environmental Safety Department introduces key operational techniques and theoretical explanations on the various factors that may be involved in the introduction of lead-free process assembly technology, including lead-free solder selection criteria, alloy considerations, patent considerations, process coordination, causes of defects, reliability testing, lead-free verification, and other modules.
It is hoped that with the experience of advanced countries or multinational companies in the introduction of lead-free process assembly technology, ETC can assist manufacturers with a complete and comprehensive concept prior to implementation, and shorten the lead-free product introduction process.
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桃園龜山
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