|
High Frequency Characteristic Test | |
| (1) |
Characteristic impedance test |
| (2) |
S-parameters (S11, S21, S12, S22) |
| (3) |
Total jitter test |
| (4) |
V.S.W.R. test |
| (5) |
Crosswalk test |
| (6) |
Eye diagram test |
| (7) |
Shielding effectiveness test |
| (8) |
Attenuation test |
| (9) |
Return loss/insertion loss test |
| (10) |
Propagation delay test |
| (11) |
Propagation skew test |
| (12) |
Group delay test |
| (13) |
FEXT test |
| (14) |
NEXT test |
| (15) |
Differential mode impedance test |
| (16) |
Differential mode delay test |
| (17) |
Common mode impedance test |
| (18) |
Mated connector impedance test |
| (19) |
Inter pair skew test |
| (20) |
Intra pair skew test | | |
|
Lead Free Solder Alloy Reliability Verification, Analysis & Test | |
| (1) |
Solderability test (Quantity-wetting balance method) |
| (2) |
Solderability test (Qualitative) |
| (3) |
Resistance to soldering heat test |
| (4) |
Steam aging test |
| (5) |
Resistance to dissolution of metallization test |
| (6) |
AUGER |
| (7) |
Scanning acoustic test |
| (8) |
SEM&EDX inspection |
| (9) |
X-RAY inspection |
| (10) |
Dye & pry inspection |
| (11) |
Micro-section tin whisker test |
| (12) |
Whisker test |
| (13) |
Optical microscope inspection |
| (14) |
X-RAY plated thickness measurement | | |
|
|
Mechanical Properties Test | |
| (1) |
Dimension
measurement |
| (2) |
Vibration test |
| (3) |
Shock test |
| (4) |
Drop test |
| (5) |
Discontinuities test |
| (6) |
Durability test |
| (7) |
Normal force test |
| (8) |
Mating & unmating force test |
| (9) |
Contact retention test |
| (10) |
Terminal strength |
| (11) |
Solder joint strength test (shear/pull) | |
 |
Network Analyzer |
 |
Eye Diagram/Total Jiter Test |
 |
Time Domain Reflect | |